Testing Lab of Power Supply/ IT / AV Products

Practical Insight：A manufacturer preparing a 100W USB-C PD charger for both markets chose to run UL 62368-1 and EN 62368-1 safety testing at a single lab in parallel. Because the two standards share the same IEC 62368-1 base framework, the lab was able to use shared test setups for most safety evaluations, running only the National Difference items separately. This parallel approach reduced the total safety testing time from approximately 6 weeks (sequential) to approximately 4 weeks.

Q1　Can I use one safety report for both EU and U.S. markets?

No. EN 62368-1 and UL 62368-1 contain National Differences and are not interchangeable. UL requires UL-listed power cords and has specific grounding requirements not found in the EN version. Each market requires its own standard-specific report.

Q2　Can EMC test data be shared between FCC and CE?

Partially. FCC Part 15B and EN 55032 have overlapping test setups for conducted and radiated emissions. A qualified lab can share measurement data where test conditions and limits align. However, CE EMC requires additional immunity testing (EN 55035) that FCC does not cover.

Q3　What is the most cost-effective certification strategy?

(1) Complete pre-compliance testing during development; (2) Choose a single lab for both EU and U.S. certifications to enable parallel testing and shared setups; (3) Design for compliance from the outset—proper PCB layout, adequate creepage/clearance, and EMI filtering; (4) Lock the design before submitting samples to avoid re-test costs.

Q4　Do DOE and ErP energy efficiency tests overlap?

The test conditions and calculation methods differ between DOE Level VI and ErP EU 2019/1782. However, a single lab can typically run both sets of measurements in one test session using the same sample, which reduces overall cost and time compared to testing separately.

Q5　How can I minimize re-test risk?

(1) Run pre-compliance EMC and safety checks during prototype development; (2) Use certified critical components (transformers, capacitors, optocouplers, fuses); (3) Follow reference designs from IC manufacturers; (4) Ensure adequate creepage and clearance distances in the PCB layout from the start.